AI software innovation is accelerating, while the chip design process is struggling to keep pace due to rising complexity and physical constraints. The big challenge now is how to close that gap. The ...
Tiling is about repeating modular units within the same chip to enhance scalability and efficiency; chiplets involve combining different silicon pieces to achieve a more diverse and powerful system ...
HSINCHU, TAIWAN - SEPTEMBER 16: A closeup of a silicon wafer on display at Taiwan Semiconductor Research Institution on September 16, 2022 in Hsinchu, Taiwan. Taiwan's semiconductor manufacturing ...
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