Copper electrodeposition is a vital process in the fabrication of microelectronic interconnects, battery components and decorative coatings. By utilising carefully formulated electrolytes and ...

FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

[A_Steingrube] has posted a guide to his favorite method of copper electroplating. Plating copper onto other metals is popular with the steampunk crowd, but it does have other uses. Copper plate is ...

VTT Technology Research Centre to use ClassOne Solstice S8 for advanced packaging This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...

In this paper, we describe a technique to prepare a copper layer on polyimide film using a polymer nanosheet as a nano-adhesion. We employ two kinds of functional polymer nanosheets: one works as an ...

Since the end of the Second World War the use of plastics has increased remarkably due to a systematic exploitation of their principal advantages, i.e. lightness, flexibility and toughness, ease of ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

The electroplating intermediate is a material used in the electroplating process to adjust characteristics such as grain size, gloss, thickness and plating speed. Most of them are configured as ...