Over the past 10 years, the DRAM market has been one of the toughest commodity businesses in the electronics industry. Bit growth has averaged more than 60% per year, but at the same time, cycles of ...
Harmony eXP, a full-wafer-contact probe card from FormFactor, can test more than 1000 DRAM devices per touchdown and is capable (for some device designs) of supporting one-touchdown testing of a full ...
Tokyo – Toshiba Corp. has developed a new cell structure for embedded DRAM on silicon-on-insulator wafers that takes advantage of SOI's specific characteristics. The cell will be an essential ...
Deemed the first all-DRAM stacked memory package using through silicon via (TSV) technology, the company's wafer-level-processed stacked package (WSP) consists of four 512-Mb DDR2 DRAM chips that ...
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