New materials and systems enable chipmakers to increase the performance and reliability of hybrid bonding, the industry’s most advanced interconnect technology New deposition systems improve the ...
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor ...
As Japan is developing the technology for mass-producing 2nm chips, they are not only trying to increase the transistor density on a single die but also to combine multiple dies with heterogeneous ...
The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by ...
Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...
AI chips reportedly being developed by Tesla using heterogeneous integration are driving up demand for IC verification analysis services, according to industry sources. Save my User ID and Password ...
Recently, a research team led by Academician Lijun Wang at CIOMP under UCAS has systematically reviewed the latest ...
Are you feeling nostalgic for homogeneous integration of chips – one flat board where you can use your fingers to stuff in all the circuitry you need? Best to head to the Lego store or Russia. The ...
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