This application note provides guidelines for the use of Wafer Level Chip Size Packages (WLCSP). The information in this application note can be used throughout the various stages of WLCSP use. This ...

Now available from multiple sources, a 3.3-mm x 3.3-mm MOSFET package reduces pc-board space requirements by up to 63% versus the SO-8, while offering similar thermal and electrical performance. Spiro ...

With the majority of dc-dc converters now using surface mount technology, there's a need for low-profile, surface-mountable power MOSFETs with the necessary dissipation and thermal properties. The ...