Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

The term “memory wall” was first coined in the 1990s to describe memory bandwidth bottlenecks that were holding back CPU performance. The semiconductor industry helped address this memory wall through ...

Inspired by how our brains function, the AI algorithms referred to in the paper are known as spiking neural networks. A ...

Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...

The growing imbalance between the amount of data that needs to be processed to train large language models (LLMs) and the inability to move that data back and forth fast enough between memories and ...

Team led by IIT Kharagpur graduates, Subhasish Mitra and Tathagata Srimani delivers first monolithic 3D chip built in a U.S.

Micron Technology showcased its latest AI-optimized memory technologies at GTC 2025, unveiling advanced DRAM solutions designed for data center and high-performance computing (HPC) applications. The ...