Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...
Morning Overview on MSN
This new 3D chip could smash the 'memory wall' slowing AI
Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...
Morning Overview on MSN
New memory design lets AI think longer and faster with no extra power
Artificial intelligence has been bottlenecked less by raw compute than by how quickly models can move data in and out of memory. A new generation of memory-centric designs is starting to change that, ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
The growing imbalance between the amount of data that needs to be processed to train large language models (LLMs) and the inability to move that data back and forth fast enough between memories and ...
A new technical paper titled “Nitride Ferroelectric Domain Wall Memory for Next-Generation Computing” was published by ...
Micron Technology showcased its latest AI-optimized memory technologies at GTC 2025, unveiling advanced DRAM solutions designed for data center and high-performance computing (HPC) applications. The ...
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