Nakajima, 58, replaces Kaoru Tosaka, 65, who was the first president of the company after it separated as a subsidiary from parent conglomerate NEC in November 2002. The change, which takes effect ...
NEC Electronics Corp. today announced that Microsoft will incorporate leading-edge embedded DRAM (eDRAM) technology from NEC Electronics in the next generation Xbox platform. The high-performance ...
KAWASAKI, Japan, TOKYO, Japan, March 16, 2010 — NEC Electronics Corporation (NEC Electronics; TSE: 6723) and Renesas Technology Corp. (Renesas Technology) today announced the new organizational ...
KAWASAKI, Japan, DUESSELDORF, Germany, and SANTA CLARA, USA -- Nov, 20 2007 --NEC Electronics Corporation and its subsidiaries NEC Electronics America, Inc. and NEC Electronics (Europe) GmbH, today ...
SANTA CLARA, Calif., ROSEVILLE, Calif. and DALLAS, Aug. 17 /PRNewswire/ -- NEC Electronics America, Inc. today announced the executive promotions of James Hettema, vice president of corporate sales, ...
NEC continues with restructuringNews from E-InSiteNEC has confirmed that as part of its business reorganisation plan announced in May, its semiconductor business will be separated from NEC. The ...
Simply sign up to the US & Canadian companies myFT Digest -- delivered directly to your inbox. Perry Capital, the US investment fund, is offering to buy a 25 per cent stake in NEC Electronics at a 65 ...
NEC Electronics Corp. last week detailed plans for building its first 300mm-wafer line, which is due to begin operation next year using a 0.13-micron manufacturing process. A 90nm process will be ...
NEC Electronics has taken the first step towards general availability of devices based on USB 3.0, the next generation standard that is expected to offer a ten-fold speed increase over the current USB ...
We’ll send you a myFT Daily Digest email rounding up the latest US & Canadian companies news every morning. Perry Capital is to increase its stake in NEC Electronics in a move that puts further ...
Kawasaki, Japan — NEC Electronics Inc. has outlined its process roadmap, tipping a new 40-nm technology while also expanding its wings in high-k dielectrics for ASICs and cell-phone chips. But ...
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