6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

I’ve experienced a lot of pain with a recent project and wanted to share some thoughts: I was doing the PCB layout on a time-critical project and needed component footprints and 3D step models. Many ...

This article introduces the basic concept of PXI-Express (PCI eXtensions for Instrumentation-Express) and studies the key considerations for modular hardware PCB layout design to achieve PXI-Express ...

A structured design review process ensures alignment across teams.

Tired of making countless wire jumpers on my perfboard prototypes, I decided to run an experiment to try to minimize manual ...

We see a lot of projects using Eagle for the schematics and PCB layout. There are a few that use Kicad, but we hear very little about other alternatives. Recently, [Limpkin] has been working with ...

Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...