(MENAFN- GetNews) As we know, solder paste printing is an essential section in the process of SMT (Surface Mount Technology). Due to the solder paste is a mixture of powder and flux, its fluidity ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

EMS companies who produce PCBA’s have been using stencils for decades, to apply solder paste to boards, but this traditional method may one day be a thing of the past. Adam Harsant, Director at ...

(MENAFN- GetNews) The main difference between SMT SPI and AOI machine is that SPI is a quality check for paste presses after stencil printer printing, through the inspection data to solder paste ...

An ultra-fine solder paste boosts print consistency, cuts cleaning time, and delivers reliable reflow performance for next-gen semiconductor packaging.

3-D techniques have the potential to offer a quantum leap in performance levels for advanced test and measurement equipment. Human vision and perception of the world rely on the ability to view ...

This application note provides guidelines for board mounting of surface mount semiconductor packages. Reflow soldering is a widely spread technology for soldering of surface mount semiconductor ...