Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including ...

MIGDAL HAEMEK, Israel, June 3, 2025 – Tower Semiconductor (TSEM), a leading foundry of high-value analog semiconductor solutions, today announced its participation in the upcoming International ...

Tower ( (TSEM)) just unveiled an announcement. On November 12, 2025, Tower Semiconductor announced the expansion of its 300mm wafer bonding technology to support heterogeneous 3D-IC integration across ...

In February 2022, semiconductor giant Intel (NASDAQ: INTC) agreed to a $5.4 billion acquisition of Tower Semiconductor (NASDAQ: TSEM), a foundry for analog semiconductor solutions. Had the acquisition ...

Intel Foundry Services (IFS) and Tower Semiconductor (Nasdaq: TSEM), a leading foundry for analog semiconductor solutions, today announced an agreement where Intel will provide foundry services and ...

Comprehensive qualified foundry IP listing A unique search mechanism for locating the most suitable IP Up-to-date information on foundry opportunities, such as available technologies and prototyping ...

SANTA CLARA, California and MIGDAL HAEMEK, Israel – May 17, 2004 – Chip maker Siliconix incorporated (Nasdaq:SILI - News), an 80.4% subsidiary of Vishay Intertechnology, Inc., and semiconductor ...

Pure-play foundry Tower Semiconductor Ltd. has inked a definitive long-term foundry agreement with International Rectifier (IR) to produce semiconductor wafers for the company utilizing IR's ...

Intel's attempted acquisition of Tower Semiconductor failed when China rejected the deal. Now Intel has partnered with Tower to provide specialty foundry U.S. manufacturing capacity and foundry ...

Intel’s advanced 300mm manufacturing facility in New Mexico to provide new capacity corridor for Tower, helping fuel future growth. SANTA CLARA, Calif. & MIGDAL HAEMEK, Israel--(BUSINESS WIRE)--Intel ...

(MENAFN- GlobeNewsWire - Nasdaq) Leveraging years of stacked BSI sensor production, Tower's wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such ...