Next year Intel introduces a new transistor — RibbonFET — and a new way of powering it called "PowerVia." The chip uses "backside power" which apparently has nothing to do with curry but can separate ...
Intel's upcoming RibbonFET technology is set to debut in the company's 20A node next year, but already the chip maker is showcasing the next step: 3D stacked CMOS (complementary metal oxide ...
Hosted on MSN
Intel Demonstrates Industry-First Advancements in Transistor and Packaging Technologies at IEDM 2024
(PR) What’s New: At the IEEE International Electron Devices Meeting (IEDM) 2024, Intel Foundry unveiled new breakthroughs to help drive the semiconductor industry forward into the next decade and ...
tom's Hardware on MSN
Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback