Power integrated modules have been widely used in motion control for their remarkable performance, easy modular installation, and high reliability. However, as the latest die technology continues to ...

A new large DIP-IPM features a compact transfer-molded package with significantly improved thermal performance compared to previous generations. In addition, it includes a temperature feedback signal ...

Mitsubishi Electric has launched a 1200V large-type Transfer-molded Dual Inline Package Intelligent Power Module (DIPIPM) Version 4 (PS22A79) with a current rating of 50A. The new power module is ...

Transfer molding can accommodate short runs, which makes it well suited for medical devices. Transfer molding is widely used in overmolding silicone products, especially the handles of medical devices ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...