Toshiba Electronics Europe has begun sampling a new generation of high‑capacity 3.5‑inch nearline hard disk drives.

The publication, titled “PCB Design Requirements: Consumer vs Industrial & Aerospace Applications – Complete Guide 2026,” ...

EnSilica has been selected to join the UK’s newly established CHERI Adoption Collective, an initiative created by PA Consulting in partnership with the Department for Science, Innovation & Technology ...

NVIDIA and Marvell Technology have entered into a strategic partnership that will connect Marvell to NVIDIA’s AI factory and AI‑RAN ecosystem through the NVLink Fusion platform, further extending ...

Driven by EDA, semiconductors, research & industry investment, India is fast becoming an innovation and production hub.

Cross‑platform tooling, efficient UI/UX workflows and deep hardware–software integration to drive embedded development.

Tria Technologies, an Avnet company specialising in embedded compute boards, systems and human–machine interfaces, has ...

China’s drive toward semiconductor self‑sufficiency is gathering pace, with the aim to be 80% self sufficient by 2030.

binder has introduced a newly developed triangular moulding that is being applied for the first time to its updated M16 cable ...

STV Group, a European defence technology integrator, and UK‑based cybersecurity firm Post‑Quantum have completed what is ...

The module incorporates an industrial‑grade STM32MP2 microprocessor and uses DDR3 memory to avoid the growing supply and cost ...

The 10BASE‑T1S REF_SPE_T1S reference design board has been developed in collaboration with Microchip Technology, Bourns and ...