US and Taiwan reach trade deal, with semiconductor chips and China in focus

The U.S. and Taiwan clinched a trade deal on Thursday that cuts tariffs on many of the semiconductor powerhouse's exports, ...
Electronic Design

Advanced SiC Power Modules Deliver High Current Density to Industrial, EV Systems

V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.

To meet 'tremendous and humongous demand' from AI customers, SK Hynix accelerates 2027 fab plans by three months, with an even fresher fab beginning waf…

Expanding production was always part of the plan—but the AI industry's demand for memory has been scaling up faster than ...
IEEE

Design Technology of Multi-Channel T/R Modules Based on Silicon-Based Stacked Packaging

Abstract: To meet the requirements for high-density integration of T/R module, a miniaturized Ku-band silicon-based stacked multi-channel T/R module was designed and implemented. The module consists ...
IEEE

Development of Embedded Multi Si Bridge Package in Panel Level Process for HPC/AI Applications

Abstract: With the recent growth of the High Performance Computing and Artificial Intelligence markets, demand for advanced package which can integrate multi-chip is increasing. The I-Cube E is a new ...