Burgopak has partnered with card manufacturer Placard to design a dual-slide bank card packaging format for fintech company ...

The course is aimed at those seeking skills in recycling methods, packaging materials, and circular economy practices.

Abstract: In this paper, warpage of fan-out wafer-level packaging (FOWLP) throughout the manufacturing process is investigated to minimize the warpage. FOWLP technology has the advantages of low cost, ...

Abstract: Noise probably the single most important performance metric of the high-speed transimpedance amplifier (TIA), which directly sets the sensitivity of optical receiver. The transimpedance ...